Technical adhesives
Structural bonding for industrial assembly
Polyurethane adhesive is a structural product for the high-strength bonding of plastic, metal and elastomer parts. Characterised by their good elasticity and robustness, they are perfectly suited to both small and large bonding surfaces.
Technical data sheetDELO-PUR® 9895 is a two-component 1:1 polyurethane adhesive, which is particularly suitable for plastic to plastic bonding in the medical sector. The curing time is quite fast, about 20 minutes. The PU-based structural adhesive has good bonding strength over time in environments subject to shock and vibration. It is ideal for compensating for the differential expansion gap between two materials.
DELO-PUR® 9894 and 9892, two-component 1:1 polyurethane adhesives are suitable in the cosmetic sector for the bonding of decorative elements on glass. It has good strength, high tack and elastic properties, ideal for bonding different materials.
The DELO-PUR® polyurethane adhesive is used in the aeronautical sector for gluing honeycombs, positioning inserts and gluing all elements in the interior of the aircraft (seats, shelves, screens, etc.). DELO adhesives meet the various aeronautical standards (AIRBUS AIMS-10-04-001) and are skydrol resistant.
DELO-PUR® polyurethane adhesive is a two-component polyurethane base, curing at room temperature. The handling time after mixing varies from 10 minutes to several hours depending on the type of adhesive.
The PU-based structural adhesive has good bonding strength over time in environments subject to shock and vibration. Its strength can reach up to 16 MPa (160kg/cm²), and it is ideal for compensating for the differential expansion gap between two materials. These adhesives are generally used over a temperature range of -40°C to +125°C.
>> How to assemble Metal & Plastic?This family of adhesives is used for multi-material mechanical assemblies, appearing as a real construction element.
Example of applications:
There are also applications in the electronics sector with the bonding of electronic housings or the holding of high quality components.
>> SEE OUR CASE STUDIES
